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多孔传输复合层的制备方法、多孔传输复合层及其应用

  • Disigner of the Invention:胡博，胡世遗，陶华冰，方晓亮，李水荣，郑南峰
  • Type of Patent:发明
  • State of Patent:专利授权
  • Application Number:CN202310319770.1
  • Authorization number:CN 116334707 B
  • Service Invention or Not:no
  • Application Date:2023-03-29
  • Publication Date:2023-06-27
  • Authorization Date:2026-04-07
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