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中文 MOBILE Version

一种SPI隔离模块及SPI通信系统

  • Disigner of the Invention:严占想、陶华冰、陶勇冰
  • Type of Patent:实用新型
  • State of Patent:专利授权
  • Application Number:CN202420155386.2
  • Authorization number:CN221531510 U
  • Service Invention or Not:no
  • Application Date:2024-01-22
  • Publication Date:2024-07-19
  • Authorization Date:2024-08-13
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